Semiconductor Equipment
BG Tape Laminator
| Specification | Unit | Details |
|---|---|---|
| Wafer Diameter | inch | 6 & 8 / 8 & 12 Auto Conversion |
| Wafer Thickness | µm | 8 inch : 150~ 12 inch : 200~ |
| Applicable Tape | - | normal BG tape, UV BG tape, bump BG tape |
| WPH | wfh | 67 (based on 12inch wafer) |
| Wafer Warpage | mm | ±5 |
| Wafer Cassette | ea | 2 |
| Tape attachment percision and X/Y direction |
mm | ±1.0 or less |
| Machine dimensions (WxDxH) |
mm | 1,610 x 2,156 x 2,044 |
| Machine weight | kg | 1,600 (approx.) |
| Controller & GUI | - | PLC & PC |
| Clean room Level | class | 1,000 |
| Noise Level | db | 80 or less |
| Power | - | 220V, 3 Pulse, 30A, 60 Hz |
| CDA | EA | 6 (0.5Mpa, Φ12 tube) |