Semiconductor Equipment
BSC Laminator
| Specification | Unit | Details |
|---|---|---|
| Wafer Diameter | inch | 8 & 12 Auto Conversion |
| Wafer Thickness | µm | 8 inch : 150~ 12 inch : 200~ |
| Supportable Tape | - | LC Tape, IRLC Tape |
| WPH | wfh | 30 (based on 12inch wafer) |
| Wafer Warpage | mm | ±5 |
| Wafer Cassette | ea | 2 |
| Tape Cutting System | - | Pinnacle Die Pre Cut system |
| Machine dimensions (WxDxH) |
mm | 2,100 x 2,140 x 2,100 |
| Machine weight | Kg | 2,500 (approx.) |
| Controller & GUI | - | PLC & PC |
| Clean Room Level | Class | 1,000 |
| Noise Level | db | 80 or less |
| Power | - | 220V, 3 Pulse, 30A, 60 Hz |
| CDA | EA | 5 (0.5Mpa, Φ12 tube) |