Semiconductor Equipment
Wafer Mounter
| Specification | Unit | Details |
|---|---|---|
| Wafer Diameter | mm | 6 & 8 / 8 & 12 Auto Conversion |
| Wafer Thickness | µm | 6 & 8inch : 150~ 12 inch : 200~ |
| Supportable Tape | - | Dicing Tape (UV, Non-UV) |
| WPH | wfh | 45 (based on 12inch wafer) |
| Wafer Warpage | mm | ±5 |
| Ring Frame Cassette | ea | 4 |
| Wafer attachment precision and X/Y direction (frame mounting) |
mm | ±0.5 or less |
| OCR Label Printer | - | 0, 90, 180, 270°, various label size, barcode reader |
| Machine dimensions (W×D×H) |
mm | 2,350 x 2,150 x 2,200 |
| Machine weight | Kg | 1,850 (approx.) |
| Controller & GUI | - | PLC & PC |
| Clean Room Level | Class | 1,000 |
| Noise Level | db | 80 or less |
| Power | - | 220V, 3 Pulse, 30A, 60 Hz |
| CDA | EA | 6 (0.5Mpa, Φ12 tube) |